断路器温升分析及多触头并联优化设计研究
朱海博1，冯伟通1，赵青青2，陈蒙生3
(1 浙江世隆电气科技有限公司，浙江 温州 325604；
2 浙江天正电气股份有限公司，浙江 温州 325604；
3 浙江人民电器有限公司，浙江 温州 325604)
Abstract: Temperature rise is a core indicator for evaluating the performance and reliability of circuit breakers. This study systematically investigated the issue of excessive local temperature rise in circuit breakers under rated current, employing a combined approach of circuit modeling, experimental testing, and simulation analysis. an equivalent resistance model of the main circuit was constructed, the relationship between heat generation and resistance was theoretically analyze. Both temperature rise tests and finite element simulation results indicated that the moving contact bridge area becomes the primary heat source due to concentrated contact resistance on both sides. Based on the principle of parallel resistance reduction, an innovative optimized design scheme using multiple sets of moving contact bridges was proposed.Theoretical derivation showed that the equivalent resistance is inversely proportional to the number of parallel groups. Two and three sets of prototype moving contact bridges were developed for comparative tests, the data revealed that the temperature rise at each monitoring point significantly decreases with the increase in the number of parallel groups, with the maximum reduction in temperature rise at key hot spots reaching 19.2 K. Verifying the effectiveness of the proposed scheme and provides a new and effective structural optimization approach for reducing the temperature rise of circuit breakers, which holds clear engineering application value.
Key words: circuit breaker; temperature rise; contact resistance; moving contact bridge; parallel structure; thermal design
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